Advanced Packaging Market Size is Forecasted to Reach US$ 52.75 Billion by 2030

According to Precedence Research, the global advanced packaging market size is forecasted to reach US$ 52.75 billion by 2030 from US$ 26.11 billion in 2021, by growing at a lucrative CAGR of 8.1% between 2021 and 2030.

The report contains 150+ pages with detailed analysis. The base year for the study has been considered 2021, the historic year 2017 to 2020, the forecast period considered is from 2021 to 2030. The report offers exclusive insights to help companies make informed decisions to sustain growth through the assessment period.

Advanced packaging is a supporting case which prevent from any physical damage or corrosion to silicon wafers, logic units, and memory during the final stage of semiconductor manufacturing procedure. In 2020, The Advanced Packaging Market was valued at US$ 24.2 billion and is expected to grow with a CAGR of 8.1% during the forecast period. It facilitates the chip connection to the circuit board. The advanced packing also involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

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Crucial factors accountable for market growth are:

• The cost effectiveness of the Advanced packaging technology drives the market growth.
• Rise in demand for automobiles in the market.
• Increased demand for consumer electronics products fosters the market growth.
• Surge in demand for miniaturization of devices.

Scope of the Advanced Packaging Market Report

Competitive Intelligence

The report provides an understanding of the market composition and explains the role of established players and regional contributors. It is essential for the market players to make calculative moves and focus on client acquisition and retention. The detailed company profiles will provide the necessary intelligence to the reader. In order to maintain their share, the market players are focusing on strategies such as cross-border expansion, product differentiation and so on.

Some of the prominent players in the global advanced packaging market are Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co., Ltd., ChipMOS Technologies, Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., King Yuan Electronics Corp. (KYEC), Nepes Corporation, Powertech Technology, Inc., Samsung Semiconductor, Inc., SIGNETICS, TianshuiHuatian Technology Co.Ltd., TongFu Microelectronics Co., Ltd., TSMC Ltd., UTAC Holdings Ltd. and Veeco Instruments Inc.

Market Dynamics

Driver – The rise in demand for consumer electronic products across the globe is accelerating the growth of the Advanced Packaging Market. furthermore, the increasing demand for miniaturization of devices is also fostering the market growth.

Restraint – The major restraining factor that will negatively impact the growth of the Advanced Packaging Market includes high cost involved in the design and manufactures of chips at each node and the expensive installation of advanced packaging technology.

Opportunity – The increasing demand for the consumer electronics products in the market and the demand for miniaturization of devices will find huge opportunities that are anticipated to drive the growth of the Advanced Packaging Market.

Challenges – The high installation and manufacturing cost of the advanced packaging is a major challenge encountered by the advanced packaging market and this is expected to hamper the market growth.

Recent Developments

• On 11th February 2021, Siemens Digital Industries Software announced that its partnership with Advanced Semiconductor Engineering, Inc. (ASE) has developed two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
• On 9th June 2021, NepesCorporationa Korea’s top semiconductor back-end process (OSAT) company announced the development of ‘nSiP’, advanced packaging technology without using the PCBs. NsiP is ased on ‘End-fab’ technology without board and wire bonding and is the most optimized packaging solution for high performance, high density, and small form factor.
• In March 2021 Deca, an industry-leading technology provider for advanced semiconductor packaging, has announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. This solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering Inc. (ASE) and Siemens Digital Industries Software.
• In February 2021, Siemens Digital Industries Software announced that the collaboration with Advanced Semiconductor Engineering, Inc. (ASE) developed two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in a data-robust graphical environment prior to and during physical design implementation.

Report Highlights

• The Fan-out wafer-level packaging (FOWLP) product type segment is accounted largest revenue share in 2020.
• The consumer electronics end use segment of the market is estimated to lead the market with largest revenue share in 2020.
• By Geography, Asia Pacific is expected to lead the market contributing more than 64% revenue share in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing the growth of semiconductor industry in this region and also by the presence of major market players.

Regional Snapshots

Asia Pacific leads the advanced packaging market contributing a market share of more than 64% in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing to the presence of major market players continuously involved in R&D and in the development of advanced packaging technologies. For instance, on 6th May 2021, Samsung Electronics, a world leader in advanced semiconductor technology, announced the availability of its next-generation 2.5D packaging technology called Interposer-Cube4 (I-Cube4). It is leading the evolution of chip packaging technology. Samsung’s I-Cube, a heterogeneous combination of technologythat uses multiple dies to operate as a single chip in one package by horizontally placing one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of the silicon interposer.

Segments Covered in the Report

By Type

• Flip Chip CSP
• Flip-Chip Ball Grid Array
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

By End-use

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Others

Regional Segmentation

– North America (U.S. and Canada)

 – Europe (Germany, France, U.K., Italy, Spain, Rest of Europe)

 – Asia-Pacific (China, Japan, India, Southeast Asia and Rest of APAC)

 – Latin America (Brazil and Rest of Latin America)

– Middle East and Africa (GCC, North Africa, South Africa, Rest of MEA)

TABLE OF CONTENT

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Advanced Packaging Market 

5.1. COVID-19 Landscape: Advanced Packaging Industry Impact

5.2. COVID 19 – Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Advanced Packaging Market, By Product

8.1. Advanced Packaging Market, by Product Type, 2021-2030

8.1.1. Flip Chip CSP

8.1.1.1. Market Revenue and Forecast (2019-2030)

8.1.2. Flip-Chip Ball Grid Array

8.1.2.1. Market Revenue and Forecast (2019-2030)

8.1.3. Wafer Level CSP

8.1.3.1. Market Revenue and Forecast (2019-2030)

8.1.4. 5D/3D

8.1.4.1. Market Revenue and Forecast (2019-2030)

8.1.5. Fan Out WLP

8.1.5.1. Market Revenue and Forecast (2019-2030)

8.1.6. Others

8.1.6.1. Market Revenue and Forecast (2019-2030)

Chapter 9. Global Advanced Packaging Market, By End User

9.1. Advanced Packaging Market, by End User, 2021-2030

9.1.1. Consumer Electronics

9.1.1.1. Market Revenue and Forecast (2019-2030)

9.1.2. Automotive

9.1.2.1. Market Revenue and Forecast (2019-2030)

9.1.3. Industrial

9.1.3.1. Market Revenue and Forecast (2019-2030)

9.1.4. Healthcare

9.1.4.1. Market Revenue and Forecast (2019-2030)

9.1.5. Aerospace & Defense

9.1.5.1. Market Revenue and Forecast (2019-2030)

9.1.6. Others

9.1.6.1. Market Revenue and Forecast (2019-2030)

Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast

10.1. North America

10.1.1. Market Revenue and Forecast, by Product (2019-2030)

10.1.2. Market Revenue and Forecast, by End User (2019-2030)

10.1.3. U.S.

10.1.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.1.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.1.4. Rest of North America

10.1.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.1.4.2. Market Revenue and Forecast, by End User (2019-2030)

10.2. Europe

10.2.1. Market Revenue and Forecast, by Product (2019-2030)

10.2.2. Market Revenue and Forecast, by End User (2019-2030)

10.2.3. UK

10.2.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.2.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.2.4. Germany

10.2.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.2.4.2. Market Revenue and Forecast, by End User (2019-2030)

10.2.5. France

10.2.5.1. Market Revenue and Forecast, by Product (2019-2030)

10.2.5.2. Market Revenue and Forecast, by End User (2019-2030)

10.2.6. Rest of Europe

10.2.6.1. Market Revenue and Forecast, by Product (2019-2030)

10.2.6.2. Market Revenue and Forecast, by End User (2019-2030)

10.3. APAC

10.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.3.3. India

10.3.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.3.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.3.4. China

10.3.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.3.4.2. Market Revenue and Forecast, by End User (2019-2030)

10.3.5. Japan

10.3.5.1. Market Revenue and Forecast, by Product (2019-2030)

10.3.5.2. Market Revenue and Forecast, by End User (2019-2030)

10.3.6. Rest of APAC

10.3.6.1. Market Revenue and Forecast, by Product (2019-2030)

10.3.6.2. Market Revenue and Forecast, by End User (2019-2030)

10.4. MEA

10.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.4.2. Market Revenue and Forecast, by End User (2019-2030)

10.4.3. GCC

10.4.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.4.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.4.4. North Africa

10.4.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.4.4.2. Market Revenue and Forecast, by End User (2019-2030)

10.4.5. South Africa

10.4.5.1. Market Revenue and Forecast, by Product (2019-2030)

10.4.5.2. Market Revenue and Forecast, by End User (2019-2030)

10.4.6. Rest of MEA

10.4.6.1. Market Revenue and Forecast, by Product (2019-2030)

10.4.6.2. Market Revenue and Forecast, by End User (2019-2030)

10.5. Latin America

10.5.1. Market Revenue and Forecast, by Product (2019-2030)

10.5.2. Market Revenue and Forecast, by End User (2019-2030)

10.5.3. Brazil

10.5.3.1. Market Revenue and Forecast, by Product (2019-2030)

10.5.3.2. Market Revenue and Forecast, by End User (2019-2030)

10.5.4. Rest of LATAM

10.5.4.1. Market Revenue and Forecast, by Product (2019-2030)

10.5.4.2. Market Revenue and Forecast, by End User (2019-2030)

Chapter 11. Company Profiles

11.1. Amkor Technology Inc.

11.1.1. Company Overview

11.1.2. Product Offerings

11.1.3. Financial Performance

11.1.4. Recent Initiatives

11.2. ASE Technology Holding Co. Ltd.

11.2.1. Company Overview

11.2.2. Product Offerings

11.2.3. Financial Performance

11.2.4. Recent Initiatives

11.3. China Wafer Level CSP Co., Ltd.

11.3.1. Company Overview

11.3.2. Product Offerings

11.3.3. Financial Performance

11.3.4. Recent Initiatives

11.4. ChipMOS Technologies, Inc.

11.4.1. Company Overview

11.4.2. Product Offerings

11.4.3. Financial Performance

11.4.4. Recent Initiatives

11.5. FlipChip International LLC

11.5.1. Company Overview

11.5.2. Product Offerings

11.5.3. Financial Performance

11.5.4. Recent Initiatives

11.6. HANA Micron Inc.

11.6.1. Company Overview

11.6.2. Product Offerings

11.6.3. Financial Performance

11.6.4. Recent Initiatives

11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.

11.7.1. Company Overview

11.7.2. Product Offerings

11.7.3. Financial Performance

11.7.4. Recent Initiatives

11.8. King Yuan Electronics Corp. (KYEC)

11.8.1. Company Overview

11.8.2. Product Offerings

11.8.3. Financial Performance

11.8.4. Recent Initiatives

11.9. Nepes Corporation

11.9.1. Company Overview

11.9.2. Product Offerings

11.9.3. Financial Performance

11.9.4. Recent Initiatives

11.10. Powertech Technology, Inc.

11.10.1. Company Overview

11.10.2. Product Offerings

11.10.3. Financial Performance

11.10.4. Recent Initiatives

Chapter 12. Research Methodology

12.1. Primary Research

12.2. Secondary Research

12.3. Assumptions

Chapter 13. Appendix

13.1. About Us

13.2. Glossary of Terms

Why should you invest in this report?

If you are aiming to enter the global advanced packaging market, this report is a comprehensive guide that provides crystal clear insights into this niche market. All the major application areas for advanced packaging are covered in this report and information is given on the important regions of the world where this market is likely to boom during the forecast period of 2021-2030 so that you can plan your strategies to enter this market accordingly.

Besides, through this report, you can have a complete grasp of the level of competition you will be facing in this hugely competitive market and if you are an established player in this market already, this report will help you gauge the strategies that your competitors have adopted to stay as market leaders in this market. For new entrants to this market, the voluminous data provided in this report is invaluable. 

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