According to Precedence Research, The advanced packaging market size garnered US$ 24.2 billion in 2020 and is expected to generate US$ 41.8 billion by 2030, manifesting a CAGR of 8.1% from 2021 to 2030. The report contains 150+ pages with detailed analysis.
The base year for the study has been considered 2021, the historic year 2019 and 2020, the forecast period considered is from 2021 to 2030. The advanced packaging market is analyzed on the basis of value (US$ Million), volume (Unit), and price (US$/Unit).
Advanced packaging is a supporting case which prevent from any physical damage or corrosion to silicon wafers, logic units, and memory during the final stage of semiconductor manufacturing procedure. In 2020, The Advanced Packaging Market was valued at US$ 24.2 billion and is expected to grow with a CAGR of 8.1% during the forecast period. It facilitates the chip connection to the circuit board. The advanced packing also involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.
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Key Companies & Market Share Insights
The market is moderately fragmented with the presence of several local companies. These market players are striving to gain higher market share by adopting strategies, such as investments, partnerships, and acquisitions & mergers, novel product introductions and developments, promotion strategies and Research and Development (R&D) activities in the marketplace. Companies are also spending on the development of improved products. Moreover, they are also focusing on maintaining competitive pricing. The competitive profiling of these players includes business and financial overview, gross margin, production, sales, and recent developments which can aid in assessing competition in the market.
Some of the major players in the global advanced packaging market include:
Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co., Ltd., ChipMOS Technologies, Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., King Yuan Electronics Corp. (KYEC), Nepes Corporation, Powertech Technology, Inc., Samsung Semiconductor, Inc., SIGNETICS, TianshuiHuatian Technology Co.Ltd., TongFu Microelectronics Co., Ltd., TSMC Ltd., UTAC Holdings Ltd. and Veeco Instruments Inc.
Advanced Packaging Market Scope
This market report studies market dynamics, status and outlook especially in North America, Europe and Asia-Pacific, Latin America, the Middle East and Africa. This research report offers scenario and forecast (revenue/volume), and categorizes the market by key players and various segment. This report also studies global market prominence, competitive landscape, market share, growth rates market dynamics such as drivers, restraints and opportunities, and distributors and sales channels.
This research study also integrates Industry Chain analysis and Porter’s Five Forces Analysis. Further, this report offers a competitive scenario that comprises collaborations, market concentration rate and expansions, mergers & acquisitions undertaken by companies.
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Crucial factors accountable for market growth are:
- The cost effectiveness of the Advanced packaging technology drives the market growth.
- Rise in demand for automobiles in the market.
- Increased demand for consumer electronics products fosters the market growth.
- Surge in demand for miniaturization of devices.
Report Highlights
- The Fan-out wafer-level packaging (FOWLP) product type segment is accounted largest revenue share in 2020.
- The consumer electronics end use segment of the market is estimated to lead the market with largest revenue share in 2020.
- By Geography, Asia Pacific is expected to lead the market contributing more than 64% revenue share in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing the growth of semiconductor industry in this region and also by the presence of major market players.
Advanced Packaging Market Dynamics
Driver – The rise in demand for consumer electronic products across the globe is accelerating the growth of the Advanced Packaging Market. furthermore, the increasing demand for miniaturization of devices is also fostering the market growth.
Restraint – The major restraining factor that will negatively impact the growth of the Advanced Packaging Market includes high cost involved in the design and manufactures of chips at each node and the expensive installation of advanced packaging technology.
Opportunity – The increasing demand for the consumer electronics products in the market and the demand for miniaturization of devices will find huge opportunities that are anticipated to drive the growth of the Advanced Packaging Market.
Challenges – The high installation and manufacturing cost of the advanced packaging is a major challenge encountered by the advanced packaging market and this is expected to hamper the market growth.
Recent Developments
- On 11th February 2021, Siemens Digital Industries Software announced that its partnership with Advanced Semiconductor Engineering, Inc. (ASE) has developed two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
- On 9th June 2021, NepesCorporationa Korea’s top semiconductor back-end process (OSAT) company announced the development of ‘nSiP’, advanced packaging technology without using the PCBs. NsiP is ased on ‘End-fab’ technology without board and wire bonding and is the most optimized packaging solution for high performance, high density, and small form factor.
- In March 2021 Deca, an industry-leading technology provider for advanced semiconductor packaging, has announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. This solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering Inc. (ASE) and Siemens Digital Industries Software.
- In February 2021, Siemens Digital Industries Software announced that the collaboration with Advanced Semiconductor Engineering, Inc. (ASE) developed two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in a data-robust graphical environment prior to and during physical design implementation.
Regional Snapshots
Asia Pacific leads the advanced packaging market contributing a market share of more than 64% in 2020 and is expected to grow at a CAGR of 8.2% during the forecast period owing to the presence of major market players continuously involved in R&D and in the development of advanced packaging technologies. For instance, on 6th May 2021, Samsung Electronics, a world leader in advanced semiconductor technology, announced the availability of its next-generation 2.5D packaging technology called Interposer-Cube4 (I-Cube4). It is leading the evolution of chip packaging technology. Samsung’s I-Cube, a heterogeneous combination of technologythat uses multiple dies to operate as a single chip in one package by horizontally placing one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory (HBM) dies on top of the silicon interposer.
Market Segments Covered
By Type
- Flip Chip CSP
- Flip-Chip Ball Grid Array
- Wafer Level CSP
- 5D/3D
- Fan Out WLP
- Others
By End-use
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Russia
- Italy
- Spain
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Research Objective
- To provide a comprehensive analysis of the advanced packaging industry and its sub-segments in the global market, thereby providing a detailed structure of the industry
- To provide detailed insights into factors driving and restraining the growth of this global market
- To provide a distribution chain analysis/value chain for the this market
- To estimate the market size of the global advanced packaging market where 2019 would be the historical period, 2020 shall be the base year, and 2020 to 2027 will be the forecast period for the study
- To provide strategic profiling of key companies (manufacturers and distributors) present across the globe, and comprehensively analyze their competitiveness/competitive landscape in this market
- To analyze the global market in four main geographies, namely, North America, Europe, Asia-Pacific, and the Rest of the World
- To provide country-wise market value analysis for various segments of the advanced packaging
TABLE OF CONTENT
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Advanced Packaging Market
5.1. COVID-19 Landscape: Advanced Packaging Industry Impact
5.2. COVID 19 – Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Advanced Packaging Market, By Product
8.1. Advanced Packaging Market, by Product Type, 2021-2030
8.1.1. Flip Chip CSP
8.1.1.1. Market Revenue and Forecast (2019-2030)
8.1.2. Flip-Chip Ball Grid Array
8.1.2.1. Market Revenue and Forecast (2019-2030)
8.1.3. Wafer Level CSP
8.1.3.1. Market Revenue and Forecast (2019-2030)
8.1.4. 5D/3D
8.1.4.1. Market Revenue and Forecast (2019-2030)
8.1.5. Fan Out WLP
8.1.5.1. Market Revenue and Forecast (2019-2030)
8.1.6. Others
8.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 9. Global Advanced Packaging Market, By End User
9.1. Advanced Packaging Market, by End User, 2021-2030
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2019-2030)
9.1.2. Automotive
9.1.2.1. Market Revenue and Forecast (2019-2030)
9.1.3. Industrial
9.1.3.1. Market Revenue and Forecast (2019-2030)
9.1.4. Healthcare
9.1.4.1. Market Revenue and Forecast (2019-2030)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2019-2030)
9.1.6. Others
9.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.4.2. Market Revenue and Forecast, by End User (2019-2030)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Technology Holding Co. Ltd.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. China Wafer Level CSP Co., Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. ChipMOS Technologies, Inc.
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. FlipChip International LLC
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. HANA Micron Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. King Yuan Electronics Corp. (KYEC)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Nepes Corporation
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Powertech Technology, Inc.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.
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