The worldwide Wi-Fi 6 And Wi-Fi 6E Chipset market measurement is anticipated to achieve USD 60.28 billion by 2030 and is anticipated to increase at a CAGR of 22.7% from 2021 to 2030.
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Growth Factors
Increasing bandwidth capacity demand among consumers and enterprises for providing support for smart devices is one of the key driving factors for the market growth.
Growing trends for e-learnings have augmented the deployment of next-generation WLAN infrastructure across several universities, schools, offices, and residents. Also, accessing the uninterrupted content during online video streaming services has increased the installation of wi-fi 6 and wi-fi 6E devices across the globe. Resultantly, it is expected to propel the wi-fi 6 and wi-fi 6E chipsets demand from 2021 to 2030.
The growing need for enhanced network bandwidth and low latency communications across enterprises is estimated to drive market growth during the forecast period. The significantly increasing data traffic has accelerated the need for superior network connectivity across several verticals such as corporate, industrial, and others. Thus, it is expected to boost the installations for wi-fi6 and wi-fi6E devices and, subsequently, their chipsets demand in the next seven years.
Report Coverage
| Report Scope | Details |
| Market Size | USD 60.28 billion by 2030 |
| Growth Rate | CAGR of 22.7% From 2021 to 2030 |
| Base Year | 2020 |
| Historic Data | 2017 to 2020 |
| Forecast Period | 2021 to 2030 |
| Segments Covered | Chipset Type, Device Type, Application |
| Regional Scope | North America, Europe, Asia Pacific, Latin America, Middle East & Africa |
| Companies Mentioned | Broadcom Inc.; Qualcomm Technologies, Inc.; ON Semiconductor Connectivity Solutions, Inc.; Intel Corporation; Celeno; MediaTek Inc.; Texas Instruments Incorporated; Cypress Semiconductor Corporation; STMICROELECTRONICS N.V.;NXP SEMICONDUCTORS N.V. |
Report Highlights
In terms of value, the wi-fi6 segment accounted for a market share of more than 90% in 2021. On the other hand, the wi-fi6E segment is projected to attain a market volume of nearly 4 billion units by 2028, exhibiting at a CAGR of 40.9% from 2021 to 2030.
Rapidly growing demand for modern devices with the supporting capability of new wireless frequency bands such as 2.4GHz, 5GHz, and 6GHz is further expected to accelerate the adoption of wi-fi6 chipsets. Additionally, offering BSS coloring features in wi-fi6 technology would enhance the network reliability in a very dense ecosystem by enabling frames from neighbor’s network.
the WLAN infrastructure devices captured a market share of 40.8% in 2021. The high market share is attributable to the soaring demand for wi-fi6 & 6E chipsets to assemble into next-generation routers, gateways, repeaters, and extenders. A robust surge in need for enhanced bandwidth capacity across enterprise customers is expected to ascend the global deployment of wi-fi6 access points/routers.
the commercial segment accounted for a significant market share of 48.2% in 2021. In terms of volume, the enterprises/corporates segment is projected to attain more than 1 billion units wi-fi6 &wi-fi6E chipsets by 2030, expanding at a CAGR of 22.1% from 2021 to 2030. The high growth is attributable to the rapidly increasing demand for superior wireless connectivity across corporate offices.
Rapidly evolving Internet of Things (IoT) devices have raised their adoption across several industry verticals, including healthcare, manufacturing, smart city, and public sector, among others. According to GVR analysis 2021, the number of IoT connections is expected to exceed 30 billion by 2030.
Asia Pacific held the largest market share of 38.9% in 2021. This is attributable to the substantial rise in the investments in developing wi-fi6 and wi-fi6E chipsets-enabled smartphones, routers, and laptops, among others. These devices support next-generation wireless frequency bands and deliver a unified network experience.
Key Players
- Broadcom Inc
- Qualcomm Technologies, Inc.
- ON Semiconductor Connectivity Solutions, Inc.
- Intel Corporation
- Celeno
- MediaTek Inc.
- Texas Instruments Incorporated
- Cypress Semiconductor Corporation
- STMICROELECTRONICS N.V.
- NXP SEMICONDUCTORS N.V.
- Others
Market Segmentation
- Chipset Type
- Wi-Fi 6
- Wi-Fi 6E
- Device Type
- WLAN Infrastructure Devices
- Consumer Devices
- Smartphones/Tablets
- Desktops/Laptops
- AR/VR and Wearables
- Smart Home Devices
- Others
- Wireless Cameras
- Industrial IoT Devices
- Connected Vehicles
- Drones
- Others
- Application
- Residential/Consumer
- Commercial
- Enterprises/Corporates
- Airports
- Stadiums
- Malls/Shops
- Hospitals
- Hotels & Restaurants
- Educational Campuses
- Others
- Industrial
- Smart Manufacturing
- Energy & Utility
- Oil & Gas and Mining
- Smart City
- Transportation & Logistics
- Government & Defense
- Others
- Enterprises/Corporates
- Regional
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Asia Pacific
- China
- India
- Japan
- Singapore
- South America
- Brazil
- Middle East & Africa (MEA)
- North America
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Reasons to Purchase this Report:
– Market segmentation analysis including qualitative and quantitative research incorporating the impact of economic and policy aspects
– Regional and country level analysis integrating the demand and supply forces that are influencing the growth of the market.
– Market value USD Million and volume Units Million data for each segment and sub-segment
– Competitive landscape involving the market share of major players, along with the new projects and strategies adopted by players in the past five years
– Comprehensive company profiles covering the product offerings, key financial information, recent developments, SWOT analysis, and strategies employed by the major market players
Table of Contents
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. Market Dynamics Analysis and Trends
5.1. Market Dynamics
5.1.1. Market Drivers
5.1.2. Market Restraints
5.1.3. Market Opportunities
5.2. Porter’s Five Forces Analysis
5.2.1. Bargaining power of suppliers
5.2.2. Bargaining power of buyers
5.2.3. Threat of substitute
5.2.4. Threat of new entrants
5.2.5. Degree of competition
Chapter 6. Competitive Landscape
6.1.1. Company Market Share/Positioning Analysis
6.1.2. Key Strategies Adopted by Players
6.1.3. Vendor Landscape
6.1.3.1. List of Suppliers
6.1.3.2. List of Buyers
Chapter 7. Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Chipset Type
7.1. Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Chipset Type, 2021-2030
7.1.1. Wi-Fi 6
7.1.1.1. Market Revenue and Forecast (2017-2030)
7.1.2. Wi-Fi 6E
7.1.2.1. Market Revenue and Forecast (2017-2030)
Chapter 8. Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Device Type
8.1. Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Device Type, 2021-2030
8.1.1. WLAN Infrastructure Devices
8.1.1.1. Market Revenue and Forecast (2017-2030)
8.1.2. Consumer Devices
8.1.2.1. Market Revenue and Forecast (2017-2030)
8.1.3. Wireless Cameras
8.1.3.1. Market Revenue and Forecast (2017-2030)
8.1.4. Industrial IoT Devices
8.1.4.1. Market Revenue and Forecast (2017-2030)
8.1.5. Connected Vehicles
8.1.5.1. Market Revenue and Forecast (2017-2030)
8.1.6. Drones
8.1.6.1. Market Revenue and Forecast (2017-2030)
8.1.7. Others
8.1.7.1. Market Revenue and Forecast (2017-2030)
Chapter 9. Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Application
9.1. Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Application, 2021-2030
9.1.1. Residential/Consumer
9.1.1.1. Market Revenue and Forecast (2017-2030)
9.1.2. Commercial
9.1.2.1. Market Revenue and Forecast (2017-2030)
Chapter 10. Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.1.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.1.3. Market Revenue and Forecast, by Application (2017-2030)
10.1.4. U.S.
10.1.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.1.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.1.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.1.5. Rest of North America
10.1.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.1.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.1.5.3. Market Revenue and Forecast, by Application (2017-2030)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.2.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.2.3. Market Revenue and Forecast, by Application (2017-2030)
10.2.4. UK
10.2.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.2.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.2.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.2.5. Germany
10.2.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.2.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.2.5.3. Market Revenue and Forecast, by Application (2017-2030)
10.2.6. France
10.2.6.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.2.6.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.2.6.3. Market Revenue and Forecast, by Application (2017-2030)
10.2.7. Rest of Europe
10.2.7.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.2.7.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.2.7.3. Market Revenue and Forecast, by Application (2017-2030)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.3.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.3.3. Market Revenue and Forecast, by Application (2017-2030)
10.3.4. India
10.3.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.3.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.3.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.3.5. China
10.3.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.3.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.3.5.3. Market Revenue and Forecast, by Application (2017-2030)
10.3.6. Japan
10.3.6.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.3.6.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.3.6.3. Market Revenue and Forecast, by Application (2017-2030)
10.3.7. Rest of APAC
10.3.7.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.3.7.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.3.7.3. Market Revenue and Forecast, by Application (2017-2030)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.4.4. GCC
10.4.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.4.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.4.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.4.5. North Africa
10.4.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.4.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.4.5.3. Market Revenue and Forecast, by Application (2017-2030)
10.4.6. South Africa
10.4.6.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.4.6.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.4.6.3. Market Revenue and Forecast, by Application (2017-2030)
10.4.7. Rest of MEA
10.4.7.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.4.7.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.4.7.3. Market Revenue and Forecast, by Application (2017-2030)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.5.3. Market Revenue and Forecast, by Application (2017-2030)
10.5.4. Brazil
10.5.4.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.5.4.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.5.4.3. Market Revenue and Forecast, by Application (2017-2030)
10.5.5. Rest of LATAM
10.5.5.1. Market Revenue and Forecast, by Chipset Type (2017-2030)
10.5.5.2. Market Revenue and Forecast, by Device Type (2017-2030)
10.5.5.3. Market Revenue and Forecast, by Application (2017-2030)
Chapter 11. Company Profiles
11.1. Broadcom Inc
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. Qualcomm Technologies, Inc.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. ON Semiconductor Connectivity Solutions, Inc.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. Intel Corporation
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. Celeno
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. MediaTek Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Texas Instruments Incorporated
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. Cypress Semiconductor Corporation
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. STMICROELECTRONICS N.V.
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. NXP SEMICONDUCTORS N.V.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
11.11. Others
11.11.1. Company Overview
11.11.2. Product Offerings
11.11.3. Financial Performance
11.11.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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