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Wi-Fi 6 And Wi-Fi 6E Chipset Market to Expand at a CAGR of 22.7 % from 2021 to 2030

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The worldwide Wi-Fi 6 And Wi-Fi 6E Chipset market measurement is anticipated to achieve USD 60.28 billion by 2030 and is anticipated to increase at a CAGR of 22.7% from 2021 to 2030.

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Growth Factors

 Increasing bandwidth capacity demand among consumers and enterprises for providing support for smart devices is one of the key driving factors for the market growth.

Growing trends for e-learnings have augmented the deployment of next-generation WLAN infrastructure across several universities, schools, offices, and residents. Also, accessing the uninterrupted content during online video streaming services has increased the installation of wi-fi 6 and wi-fi 6E devices across the globe. Resultantly, it is expected to propel the wi-fi 6 and wi-fi 6E chipsets demand from 2021 to 2030.

The growing need for enhanced network bandwidth and low latency communications across enterprises is estimated to drive market growth during the forecast period. The significantly increasing data traffic has accelerated the need for superior network connectivity across several verticals such as corporate, industrial, and others. Thus, it is expected to boost the installations for wi-fi6 and wi-fi6E devices and, subsequently, their chipsets demand in the next seven years.

Report Coverage

Report Scope Details
Market Size USD 60.28 billion by 2030
Growth Rate CAGR of 22.7% From 2021 to 2030
Base Year 2020
Historic Data 2017 to 2020
Forecast Period 2021 to 2030
Segments Covered Chipset Type, Device Type, Application
Regional Scope North America, Europe, Asia Pacific, Latin America, Middle East & Africa
Companies Mentioned Broadcom Inc.; Qualcomm Technologies, Inc.; ON Semiconductor Connectivity Solutions, Inc.; Intel Corporation; Celeno; MediaTek Inc.; Texas Instruments Incorporated; Cypress Semiconductor Corporation; STMICROELECTRONICS N.V.;NXP SEMICONDUCTORS N.V.

Report Highlights

In terms of value, the wi-fi6 segment accounted for a market share of more than 90% in 2021. On the other hand, the wi-fi6E segment is projected to attain a market volume of nearly 4 billion units by 2028, exhibiting at a CAGR of 40.9% from 2021 to 2030.

Rapidly growing demand for modern devices with the supporting capability of new wireless frequency bands such as 2.4GHz, 5GHz, and 6GHz is further expected to accelerate the adoption of wi-fi6 chipsets. Additionally, offering BSS coloring features in wi-fi6 technology would enhance the network reliability in a very dense ecosystem by enabling frames from neighbor’s network.

the WLAN infrastructure devices captured a market share of 40.8% in 2021. The high market share is attributable to the soaring demand for wi-fi6 & 6E chipsets to assemble into next-generation routers, gateways, repeaters, and extenders. A robust surge in need for enhanced bandwidth capacity across enterprise customers is expected to ascend the global deployment of wi-fi6 access points/routers.

the commercial segment accounted for a significant market share of 48.2% in 2021. In terms of volume, the enterprises/corporates segment is projected to attain more than 1 billion units wi-fi6 &wi-fi6E chipsets by 2030, expanding at a CAGR of 22.1% from 2021 to 2030. The high growth is attributable to the rapidly increasing demand for superior wireless connectivity across corporate offices.

Rapidly evolving Internet of Things (IoT) devices have raised their adoption across several industry verticals, including healthcare, manufacturing, smart city, and public sector, among others. According to GVR analysis 2021, the number of IoT connections is expected to exceed 30 billion by 2030.

Asia Pacific held the largest market share of 38.9% in 2021. This is attributable to the substantial rise in the investments in developing wi-fi6 and wi-fi6E chipsets-enabled smartphones, routers, and laptops, among others. These devices support next-generation wireless frequency bands and deliver a unified network experience.

Key Players

  • Broadcom Inc
  • Qualcomm Technologies, Inc.
  • ON Semiconductor Connectivity Solutions, Inc.
  • Intel Corporation
  • Celeno
  • MediaTek Inc.
  • Texas Instruments Incorporated
  • Cypress Semiconductor Corporation
  • STMICROELECTRONICS N.V.
  • NXP SEMICONDUCTORS N.V.
  • Others

Market Segmentation

  • Chipset Type
    • Wi-Fi 6
    • Wi-Fi 6E
  • Device Type
    • WLAN Infrastructure Devices
    • Consumer Devices
      • Smartphones/Tablets
      • Desktops/Laptops
      • AR/VR and Wearables
      • Smart Home Devices
      • Others
    • Wireless Cameras
    • Industrial IoT Devices
    • Connected Vehicles
    • Drones
    • Others
  • Application
    • Residential/Consumer
    • Commercial
      • Enterprises/Corporates
        • Airports
        • Stadiums
        • Malls/Shops
        • Hospitals
        • Hotels & Restaurants
        • Educational Campuses
        • Others
      • Industrial
        • Smart Manufacturing
        • Energy & Utility
        • Oil & Gas and Mining
      • Smart City
      • Transportation & Logistics
      • Government & Defense
      • Others
  • Regional
    • North America
      • U.S.
      • Canada
      • Mexico
    • Europe
      • U.K.
      • Germany
      • France
    • Asia Pacific
      • China
      • India
      • Japan
      • Singapore
    • South America
      • Brazil
    • Middle East & Africa (MEA)

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Reasons to Purchase this Report:

– Market segmentation analysis including qualitative and quantitative research incorporating the impact of economic and policy aspects
– Regional and country level analysis integrating the demand and supply forces that are influencing the growth of the market.
– Market value USD Million and volume Units Million data for each segment and sub-segment
– Competitive landscape involving the market share of major players, along with the new projects and strategies adopted by players in the past five years
– Comprehensive company profiles covering the product offerings, key financial information, recent developments, SWOT analysis, and strategies employed by the major market players

Table of Contents

Chapter 1.  Introduction

1.1.  Research Objective

1.2.  Scope of the Study

1.3.  Definition

Chapter 2.  Research Methodology

2.1.  Research Approach

2.2.  Data Sources

2.3.  Assumptions & Limitations

Chapter 3.  Executive Summary

3.1.  Market Snapshot

Chapter 4.  Market Variables and Scope

4.1.  Introduction

4.2.  Market Classification and Scope

4.3.  Industry Value Chain Analysis

4.3.1.    Raw Material Procurement Analysis

4.3.2.    Sales and Distribution Channel Analysis

4.3.3.    Downstream Buyer Analysis

Chapter 5.  Market Dynamics Analysis and Trends

5.1.  Market Dynamics

5.1.1.    Market Drivers

5.1.2.    Market Restraints

5.1.3.    Market Opportunities

5.2.  Porter’s Five Forces Analysis

5.2.1.    Bargaining power of suppliers

5.2.2.    Bargaining power of buyers

5.2.3.    Threat of substitute

5.2.4.    Threat of new entrants

5.2.5.    Degree of competition

Chapter 6.  Competitive Landscape

6.1.1.    Company Market Share/Positioning Analysis

6.1.2.    Key Strategies Adopted by Players

6.1.3.    Vendor Landscape

6.1.3.1.        List of Suppliers

6.1.3.2.        List of Buyers

Chapter 7.  Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Chipset Type

7.1.  Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Chipset Type, 2021-2030

7.1.1.    Wi-Fi 6

7.1.1.1.        Market Revenue and Forecast (2017-2030)

7.1.2.    Wi-Fi 6E

7.1.2.1.        Market Revenue and Forecast (2017-2030)

Chapter 8.  Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Device Type

8.1.  Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Device Type, 2021-2030

8.1.1.    WLAN Infrastructure Devices

8.1.1.1.        Market Revenue and Forecast (2017-2030)

8.1.2.    Consumer Devices

8.1.2.1.        Market Revenue and Forecast (2017-2030)

8.1.3.    Wireless Cameras

8.1.3.1.        Market Revenue and Forecast (2017-2030)

8.1.4.    Industrial IoT Devices

8.1.4.1.        Market Revenue and Forecast (2017-2030)

8.1.5.    Connected Vehicles

8.1.5.1.        Market Revenue and Forecast (2017-2030)

8.1.6.    Drones

8.1.6.1.        Market Revenue and Forecast (2017-2030)

8.1.7.    Others

8.1.7.1.        Market Revenue and Forecast (2017-2030)

Chapter 9.  Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Application

9.1.  Wi-Fi 6 And Wi-Fi 6E Chipset Market, by Application, 2021-2030

9.1.1.    Residential/Consumer

9.1.1.1.        Market Revenue and Forecast (2017-2030)

9.1.2.    Commercial

9.1.2.1.        Market Revenue and Forecast (2017-2030)

Chapter 10.      Global Wi-Fi 6 And Wi-Fi 6E Chipset Market, Regional Estimates and Trend Forecast

10.1.        North America

10.1.1.  Market Revenue and Forecast, by Chipset Type (2017-2030)

10.1.2.  Market Revenue and Forecast, by Device Type (2017-2030)

10.1.3.  Market Revenue and Forecast, by Application (2017-2030)

10.1.4.  U.S.

10.1.4.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.1.4.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.1.4.3.      Market Revenue and Forecast, by Application (2017-2030)

10.1.5.  Rest of North America

10.1.5.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.1.5.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.1.5.3.      Market Revenue and Forecast, by Application (2017-2030)

10.2.        Europe

10.2.1.  Market Revenue and Forecast, by Chipset Type (2017-2030)

10.2.2.  Market Revenue and Forecast, by Device Type (2017-2030)

10.2.3.  Market Revenue and Forecast, by Application (2017-2030)

10.2.4.  UK

10.2.4.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.2.4.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.2.4.3.      Market Revenue and Forecast, by Application (2017-2030)

10.2.5.  Germany

10.2.5.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.2.5.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.2.5.3.      Market Revenue and Forecast, by Application (2017-2030)

10.2.6.  France

10.2.6.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.2.6.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.2.6.3.      Market Revenue and Forecast, by Application (2017-2030)

10.2.7.  Rest of Europe

10.2.7.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.2.7.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.2.7.3.      Market Revenue and Forecast, by Application (2017-2030)

10.3.        APAC

10.3.1.  Market Revenue and Forecast, by Chipset Type (2017-2030)

10.3.2.  Market Revenue and Forecast, by Device Type (2017-2030)

10.3.3.  Market Revenue and Forecast, by Application (2017-2030)

10.3.4.  India

10.3.4.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.3.4.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.3.4.3.      Market Revenue and Forecast, by Application (2017-2030)

10.3.5.  China

10.3.5.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.3.5.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.3.5.3.      Market Revenue and Forecast, by Application (2017-2030)

10.3.6.  Japan

10.3.6.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.3.6.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.3.6.3.      Market Revenue and Forecast, by Application (2017-2030)

10.3.7.  Rest of APAC

10.3.7.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.3.7.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.3.7.3.      Market Revenue and Forecast, by Application (2017-2030)

10.4.        MEA

10.4.1.  Market Revenue and Forecast, by Chipset Type (2017-2030)

10.4.2.  Market Revenue and Forecast, by Device Type (2017-2030)

10.4.3.  Market Revenue and Forecast, by Application (2017-2030)

10.4.4.  GCC

10.4.4.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.4.4.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.4.4.3.      Market Revenue and Forecast, by Application (2017-2030)

10.4.5.  North Africa

10.4.5.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.4.5.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.4.5.3.      Market Revenue and Forecast, by Application (2017-2030)

10.4.6.  South Africa

10.4.6.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.4.6.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.4.6.3.      Market Revenue and Forecast, by Application (2017-2030)

10.4.7.  Rest of MEA

10.4.7.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.4.7.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.4.7.3.      Market Revenue and Forecast, by Application (2017-2030)

10.5.        Latin America

10.5.1.  Market Revenue and Forecast, by Chipset Type (2017-2030)

10.5.2.  Market Revenue and Forecast, by Device Type (2017-2030)

10.5.3.  Market Revenue and Forecast, by Application (2017-2030)

10.5.4.  Brazil

10.5.4.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.5.4.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.5.4.3.      Market Revenue and Forecast, by Application (2017-2030)

10.5.5.  Rest of LATAM

10.5.5.1.      Market Revenue and Forecast, by Chipset Type (2017-2030)

10.5.5.2.      Market Revenue and Forecast, by Device Type (2017-2030)

10.5.5.3.      Market Revenue and Forecast, by Application (2017-2030)

Chapter 11.  Company Profiles

11.1.              Broadcom Inc

11.1.1.  Company Overview

11.1.2.  Product Offerings

11.1.3.  Financial Performance

11.1.4.  Recent Initiatives

11.2.              Qualcomm Technologies, Inc.

11.2.1.  Company Overview

11.2.2.  Product Offerings

11.2.3.  Financial Performance

11.2.4.  Recent Initiatives

11.3.              ON Semiconductor Connectivity Solutions, Inc.

11.3.1.  Company Overview

11.3.2.  Product Offerings

11.3.3.  Financial Performance

11.3.4.  Recent Initiatives

11.4.              Intel Corporation

11.4.1.  Company Overview

11.4.2.  Product Offerings

11.4.3.  Financial Performance

11.4.4.  Recent Initiatives

11.5.              Celeno

11.5.1.  Company Overview

11.5.2.  Product Offerings

11.5.3.  Financial Performance

11.5.4.  Recent Initiatives

11.6.              MediaTek Inc.

11.6.1.  Company Overview

11.6.2.  Product Offerings

11.6.3.  Financial Performance

11.6.4.  Recent Initiatives

11.7.              Texas Instruments Incorporated

11.7.1.  Company Overview

11.7.2.  Product Offerings

11.7.3.  Financial Performance

11.7.4.  Recent Initiatives

11.8.              Cypress Semiconductor Corporation

11.8.1.  Company Overview

11.8.2.  Product Offerings

11.8.3.  Financial Performance

11.8.4.  Recent Initiatives

11.9.              STMICROELECTRONICS N.V.

11.9.1.  Company Overview

11.9.2.  Product Offerings

11.9.3.  Financial Performance

11.9.4.  Recent Initiatives

11.10.           NXP SEMICONDUCTORS N.V.

11.10.1.               Company Overview

11.10.2.               Product Offerings

11.10.3.               Financial Performance

11.10.4.               Recent Initiatives

11.11.           Others

11.11.1.               Company Overview

11.11.2.               Product Offerings

11.11.3.               Financial Performance

11.11.4.               Recent Initiatives

Chapter 12.  Research Methodology

12.1.              Primary Research

12.2.              Secondary Research

12.3.              Assumptions

Chapter 13.  Appendix

13.1.              About Us

13.2.              Glossary of Terms

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