Die Attach Equipment Market to Reach USD 2.60 Bn by 2034
The global die attach equipment market size is calculated USD 1.45 billion in 2024 and is projected to cross around USD 2.60 billion by 2034 with a CAGR of 6.00% from 2025 to 2034.
Die Attach Equipment Market Key Takeaways
- Asia Pacific dominated the die attach equipment market in 2024.
- North America is expected to witness rapid growth in the coming years.
- By type, the die bonder segment dominated the market in 2024.
- By type, the flip chip bonder segment is projected to grow at a significant rate during the forecast period.
- By technique, the epoxy segment held the largest market share in 2024.
- By technique, the soft solder segment is anticipated to expand at a notable CAGR between 2025 and 2034.
- By application, the LED segment led the market in 2024.
- By application, the optoelectronics segment is expected to grow at a notable rate during the projection period.
Market Overview
The Die Attach Equipment Market is evolving rapidly as technological innovations reshape the semiconductor assembly and packaging sector. Die attach machines play a vital role in connecting integrated circuit chips to substrates using adhesive or solder materials. As device complexity increases, manufacturers are adopting more sophisticated equipment to maintain efficiency and yield.
Drivers
Key growth drivers include the rising demand for high-frequency and low-power consumption devices in mobile phones, tablets, and laptops. The expansion of data centers and the adoption of 5G technology have also intensified the need for reliable and high-speed semiconductor components, driving investment in die bonding equipment.
Opportunities
The development of fully automated and AI-integrated die attach systems presents a major opportunity for market players. These innovations enable higher throughput, lower error rates, and better traceability. Moreover, emerging trends in heterogeneous integration and wafer-level packaging are expected to boost demand for precision bonding equipment in the coming years.
Challenges
Challenges include the high cost of ownership and maintenance associated with advanced die attach machines. Small and medium-sized enterprises often find it difficult to invest in these capital-intensive technologies. Furthermore, a shortage of skilled labor and complexities in handling varied die sizes and materials can hamper operational efficiency.
Regional Insights
Asia-Pacific continues to be the most prominent region due to the concentration of semiconductor foundries and OEMs. China, Taiwan, and South Korea are leading the charge with heavy investments in electronics manufacturing. The United States remains a key player owing to its leadership in innovation, while Europe’s growth is closely tied to automotive and industrial electronics demand.
Recent Developments
Recent developments in the die attach equipment market include the launch of hybrid systems capable of supporting multiple bonding technologies within a single platform. Companies are also investing in sustainability through energy-efficient equipment designs. Additionally, collaborations with research institutions are resulting in smarter solutions tailored for the upcoming generation of chips.
Die Attach Equipment Market Companies
- Fasford Technology Co. Limited
- Inseto UK Limited
- Shinkawa Limited
- BE Semiconductor Industries N.V
- MicroAssembly Technologies Limited
- ASM Pacific Technology Limited
- Palomar Technologies
- Dr. Tresky AG
- Panasonic Industry Co., Ltd.
- Kulicke
- Soffa Industries
Segments Covered in the Report
By Type
- Flip Chip Bonder
- Die Bonder
By Technique
- Epoxy
- Soft Solder
- Sintering
- Eutectic
- Others
By Application
- RF and MEMS
- Optoelectronics
- Logic
- Memory
- CMOS image sensors
- LED
- Others
By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East and Africa